US Patent No. 11,116,100

IMPLEMENTATION MODULE FOR STACKED CONNECTION BETWEEN ISOLATED CIRCUIT COMPONENTS AND THE CIRCUIT THEREOF


Patent No. 11,116,100
Issue Date September 07, 2021
Title Implementation Module For Stacked Connection Between Isolated Circuit Components And The Circuit Thereof
Inventorship Yipu Zheng, Shenzhen (CN)
Assignee SHENZHEN XILONG TOY COMPANY LIMITED, Shenzhen (CN)

Claim of US Patent No. 11,116,100


1. A modularized circuit for isolated circuit, whereinthe isolated circuit includes at least two circuit components connecting in parallel and/or series;
the circuit components, in accordance with a connection configuration of a circuit, weld a plurality of corresponding pins of the circuit components directly, making the circuit components form an integrated module in accordance with a connection method of the circuit, and saving circuit boards and wires;
the circuit components are designed in a parallelepiped, and a plurality of bonding pads are arranged on part of an area on a surface of the parallelepiped; and
the circuit components further comprise a triode, and three different bonding pad areas including a base electrode area, a collector area and an emitter area are designed on the triode.