US Patent No. 11,116,097

DAMPING COVERS FOR POWER INVERTER MODULES AND INTEGRATED POWER ELECTRONICS MODULES UTILIZING THE SAME


Patent No. 11,116,097
Issue Date September 07, 2021
Title Damping Covers For Power Inverter Modules And Integrated Power Electronics Modules Utilizing The Same
Inventorship Qigui Wang, Rochester Hills, MI (US)
Song He, Troy, MI (US)
Seongchan Pack, West Bloomfield, MI (US)
Angela P. Willis, Ortonville, MI (US)
Assignee GM Global Technology Operations LLC, Detroit, MI (US)

Claim of US Patent No. 11,116,097


1. A damping cover for an integrated power electronics module (IPEM),the IPEM including an IPEM casing and a power inverter module (PIM) attached to the IPEM casing,
the IPEM casing defining an internal chamber within which is housed the PIM,
the damping cover comprising:
a damping cover body including opposing top and bottom sides,
the damping cover body configured to sealingly mount to the IPEM casing such that the bottom side is adjacent the PIM and the PIM is enclosed between the damping cover body and the IPEM casing,
the damping cover body including:an aluminum foam core including a top surface corresponding to the top side of the damping cover body and a bottom surface corresponding to the bottom side of the damping cover body;
a polymeric material over-molding covering the top surface of the aluminum foam core; and

an aluminum plate layer covering a top surface of the polymeric material over-molding and forming an outermost surface of the top side of the damping cover body.