US Patent No. 11,116,096

MEDIUM FOR BINDING COMPONENTS IN AN ASSEMBLY OF AN ELECTRONIC DEVICE, A METHOD OF PREPARING THE SAME, A DISPLAY ASSEMBLY OF AN ELECTRONIC DEVICE, AND A SYSTEM FOR SIMULATING MECHANICAL BEHAVIOURS OF THE ELECTRONIC DEVICE AND THE MEDIUM


Patent No. 11,116,096
Issue Date September 07, 2021
Title Medium For Binding Components In An Assembly Of An Electronic Device, A Method Of Preparing The Same, A Display Assembly Of An Electronic Device, And A System For Simulating Mechanical Behaviours Of The Electronic Device And The Medium
Inventorship Xinrui Niu, Kowloon (HK)
Bo Xu, Kowloon (HK)
Assignee City University of Hong Kong, Kowloon (HK)

Claim of US Patent No. 11,116,096


1. A medium for binding components in an assembly of an electronic device, comprising:a first layer of material defining a first portion having mechanical properties and arranged to connect with a first component of the assembly; and
a second layer of material, being disposed directly adjacent to the first layer of material, defining a second portion having a set of mechanical properties with one or more values different from those in the first portion, and the second layer of material is arranged to connect with a second component of the assembly;
wherein both the first layer of material and the second layer of material comprises a polymeric composite containing a polymer matrix, and at least one of the first layer of material and the second layer of material further comprises ceramic fillers, and the first layer of material and the second layer of material include different contents of ceramic fillers;
wherein a combination of the first layer of material and the second layer of material is arranged to minimize stress established in the first component when the first component combines with the second component;
wherein each of the first layer of material and the second layer of material includes 0.1-10% of volume percentage of ceramic fillers.