US Patent No. 11,116,088

SEMICONDUCTOR STORAGE DEVICE


Patent No. 11,116,088
Issue Date September 07, 2021
Title Semiconductor Storage Device
Inventorship Shinya Ohashi, Kamakura (JP)
Katsumi Izawa, Yokohama (JP)
Assignee TOSHIBA MEMORY CORPORATION, Minato-ku (JP)

Claim of US Patent No. 11,116,088


1. A semiconductor storage device, comprising:a substrate having a first principal surface and a second principal surface, the second principal surface being arranged on an opposite side of the first principal surface;
a first memory and a controller arranged on the first principal surface;
a second memory arranged on the second principal surface;
a first conductive cover that is provided on a side of the first principal surface and that covers at least a part of the first memory and the controller; and
a second conductive cover that is provided on a side of the second principal surface and that covers at least a part of the second memory,
wherein the substrate hasa first notched portion arranged at a first position in a first edge of the substrate,
a second notched portion arranged at a second position in a second edge of the substrate,
a third notched portion arranged at a third position in the first edge of the substrate, and
a fourth notched portion arranged at a fourth position in the second edge of the substrate,

the first conductive cover hasa first top plate portion,
a first side plate portion,
a second side plate portion,
a first claw portion that is extended from a lower end of the first side plate in a direction intersecting with the first principal surface and that is interlocked with the first notched portion,
a second claw portion that is extended from a lower end of the second side plate in the direction intersecting with the first principal surface and that is interlocked with the second notched portion,

the second conductive cover hasa second top plate portion,
a third side plate portion,
a fourth side plate portion,
a third claw portion that is extended from a lower end of the third side plate in a direction intersecting with the second principal surface and that is interlocked with the third notched portion, and
a fourth claw portion that is extended from a lower end of the fourth side plate in the direction intersecting with the second principal surface and that is interlocked with the fourth notched portion,

the substrate, the first conductive cover, and the second conductive cover each have a shape complying with a form factor,
the first notched portion is arranged at the first position in a first outer edge of the shape,
the second notched portion is arranged at the second position in a second outer edge of the shape,
the third notched portion is arranged at the third position in the first outer edge of the shape, and
the fourth notched portion is arranged at the fourth position in the second outer edge of the shape.