US Patent No. 11,116,083

ELECTRONIC COMPONENT EMBEDDED BY LAMINATE SHEET


Patent No. 11,116,083
Issue Date September 07, 2021
Title Electronic Component Embedded By Laminate Sheet
Inventorship Annie Tay, Singapore (SG)
Mikael Tuominen, Shanghai (CN)
Assignee

Claim of US Patent No. 11,116,083


1. A component carrier, comprising:a core having a recess;
an electronic component arranged in the recess, wherein a vertical thickness of the electronic component is larger than a vertical thickness of the core;
a laminated electrically insulating sheet covering at least part of a top main surface of the core, the laminated electrically insulating sheet with a through hole or indentation at the position of the electronic component, the laminated insulating sheet having a thickness approximately equal to a difference of the vertical thickness of the electronic component and the vertical thickness of the core, the laminated electrically insulating sheet filling a gap between a lateral surface of the electronic component and a lateral surface of the core in the recess; and
an electrically insulating layer structure formed on top of the laminated electrically insulating sheet, so that the electrically insulating layer structure covers the electronic component;
wherein an electrically conductive layer structure formed on the electrically insulating layer structure covers vertical walls of the core defining the recess, the electronic component and the recess; and
wherein a build-up on an upper main surface of the laminated electrically insulating sheet is substantially symmetrical to another build-up on a lower main surface of the core, the electronic component and the laminated electrically insulating sheet.