US Patent No. 11,116,077

WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE


Patent No. 11,116,077
Issue Date September 07, 2021
Title Wiring Board, Electronic Device, And Electronic Module
Inventorship Takuo Kisaki, Satsumasendai (JP)
Keisuke Sawada, Satsumasendai (JP)
Assignee KYOCERA CORPORATION, Kyoto (JP)

Claim of US Patent No. 11,116,077


1. A wiring board comprising:an insulation substrate comprising a main surface and a penetrating portion that has an insulation property; and
an external connection conductor, a portion of which is positioned in the insulation substrate and a different portion of which is exposed at the main surface, the entire external connection conductor embedded within the insulation substrate,
wherein the penetrating portion is embedded within the insulation substrate and penetrates into the external connection conductor.