16. A component carrier, comprising:a stack comprising at least one electrically conductive layer structure and a plurality of electrically insulating layer structures;
a component embedded in an encapsulant in the stack;
wherein the plurality of electrically insulating layer structures further comprises a first dielectric structure and a second dielectric structure differing from each other concerning at least one physical property; and
at least one opening provided in the stack and filled by a filling material, wherein the filling material is different to a material of the encapsulant in terms of a coefficient of thermal expansion and/or a Young modulus so that the component carrier is yieldable or flexible during thermal expansion to thereby suppress warpage of the component carrier.