US Patent No. 11,116,075

COMPONENT CARRIER COMPRISING DIELECTRIC STRUCTURES WITH DIFFERENT PHYSICAL PROPERTIES


Patent No. 11,116,075
Issue Date September 07, 2021
Title Component Carrier Comprising Dielectric Structures With Different Physical Properties
Inventorship Kim Liu, KunShan (CN)
Nick Xin, Shanghai (CN)
Howard Li, Shanghai (CN)
Henry Guo, Suqian (CN)
Assignee

Claim of US Patent No. 11,116,075


16. A component carrier, comprising:a stack comprising at least one electrically conductive layer structure and a plurality of electrically insulating layer structures;
a component embedded in an encapsulant in the stack;
wherein the plurality of electrically insulating layer structures further comprises a first dielectric structure and a second dielectric structure differing from each other concerning at least one physical property; and
at least one opening provided in the stack and filled by a filling material, wherein the filling material is different to a material of the encapsulant in terms of a coefficient of thermal expansion and/or a Young modulus so that the component carrier is yieldable or flexible during thermal expansion to thereby suppress warpage of the component carrier.