US Patent No. 11,116,074

COLORED THIN COVERING FILM AND MANUFACTURING METHOD


Patent No. 11,116,074
Issue Date September 07, 2021
Title Colored Thin Covering Film And Manufacturing Method
Inventorship Wei-Chih Lee, Zhubei (TW)
Li-Chih Yang, Zhubei (TW)
Chien-Hui Lee, Zhubei (TW)
Assignee ASIA ELECTRONIC MATERIAL CO., LTD., Hsinchu County (TW)

Claim of US Patent No. 11,116,074


1. A colored thin covering film, comprising:an upper detached layer;
a colored ink layer formed on the upper detached layer and having a thickness of from 1 ?m to 10 ?m;
a low dielectric glue layer formed on the colored ink layer to sandwich the colored ink layer between the upper detached layer and the low dielectric glue layer, the low dielectric glue layer having a thickness of from 3 ?m to 25 ?m for a total thickness between the colored ink layer and the low dielectric glue layer to be from 4 ?m to 35 ?m; and
a lower detached layer formed on the low dielectric glue layer to sandwich the low dielectric glue layer between the colored ink layer and the lower detached layer,
wherein the low dielectric glue layer comprises sintered silicon dioxide, polytetrafluoroethylene, a fluorine-based resin excluded from polytetrafluoroethylene, a phosphorus-based flame retardant, and a polyimide resin, with a total content of the sintered silicon dioxide, the polytetrafluoroethylene, the fluorine-based resin excluded from polytetrafluoroethylene, and the phosphorus-based flame retardant to be from 8 wt % to 50 wt % of a total solid content of the low dielectric glue layer, and the polyimide resin has a content from 40 wt % to 90 wt % of the total solid content of the low dielectric glue layer,
wherein the sintered silicon dioxide has a content from 2 wt % to 15 wt % of the total solid content of the low dielectric glue layer, the polytetrafluoroethylene has a content from 2 wt % to 10 wt % of the total solid content of the low dielectric glue layer, the fluorine-based resin excluded from polytetrafluoroethylene has a content from 2 wt % to 10 wt % of the total solid content of the low dielectric glue layer, and the phosphorus-based flame retardant has a content from 2 wt % to 15 wt % of the total solid content of the low dielectric glue layer.