US Patent No. 11,116,070

INTERCONNECT CIRCUIT METHODS AND DEVICES


Patent No. 11,116,070
Issue Date September 07, 2021
Title Interconnect Circuit Methods And Devices
Inventorship Kevin Michael Coakley, Belmont, CA (US)
Malcolm Parker Brown, San Francisco, CA (US)
Dongao Yang, Redwood City, CA (US)
Michael Lawrence Miller, San Mateo, CA (US)
Paul Henry Lego, Woodside, CA (US)
Assignee CELLINK CORPORATION, San Carlos, CA (US)

Claim of US Patent No. 11,116,070


1. A method of forming an interconnect circuit, the method comprising:laminating a substrate to a conductive layer,wherein the conductive layer is a metal foil, comprising a first side and a second side, opposite of the first side, and having a constant thickness, and
wherein the substrate comprises an adhesive layer, laminated to the second side of the conductive layer;

patterning the conductive layer, while the conductive layer remains laminated to the substrate,wherein patterning the conductive layer forms a first conductive portion and a second conductive portion of the conductive layer, at least partially separated from the first conductive portion,
wherein the substrate maintains orientation of the first conductive portion relative to the second conductive portion after patterning the conductive layer;

after patterning the conductive layer, laminating a first insulator to the first side of the conductive layer; and
after laminating the first insulator to the first side of the conductive layer, removing the substrate from the conductive layer,wherein the first insulator maintains the orientation of the first conductive portion relative to the second conductive portion after the substrate is removed.