US Patent No. 11,114,367

MOLDED INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME


Patent No. 11,114,367
Issue Date September 07, 2021
Title Molded Integrated Circuit Packages And Methods Of Forming The Same
Inventorship Lily Khor, Ipoh (MY)
Phuah Kian Keung, Ipoh (MY)
Assignee Carsem (M) SDN. BHD., Ipoh (MY)

Claim of US Patent No. 11,114,367


1. An IC package, comprising:a first leadframe, comprising:a first die pad, and
a plurality of first leads;

?a first die comprising a plurality of first bond pads, wherein the first die is attached to the first die pad of the first leadframe;
?a plurality of first bond wires, each attached to one of the first bond pads of the first die and to one of the first leads of the first leadframe;
?a first molded package body formed from a molding compound molded over each of:a portion of the first die pad of the first leadframe,
a portion of the first leads of the first leadframe,
a first portion of the first die, and
one or more of the first bond wires,

?wherein the first molded package body partially defines a first cavity, and wherein a second portion of the first die contacts neither of the first die pad and the first molded package body;
?a second die comprising a plurality of second bond pads, wherein the second die is attached to the second portion of the first die in the first cavity; and
?a plurality of second bond wires, each attached to one of the first bond pads of the first die and to one of the second bond pads of the second die; and
a second leadframe, comprising:
?a second die pad, and
?a plurality of second leads;
a third die, comprising a plurality of third bond pads, wherein the third die is attached to the second die pad of the second leadframe;
a plurality of third bond wires, each attached to one of the third bond pads of the third die and to one of the second leads of the second leadframe;
a second molded package body formed from the molding compound molded over each of:a portion of the second die pad of the second leadframe,
a portion of the second leads of the second leadframe,
a first portion of the third die, and
one or more of the third bond wires,
wherein the second molded package body partially defines a second cavity for the third die, and wherein a second portion of the third die contacts neither of the second die pad and the second molded package body;

a fourth die, comprising a plurality of fourth bond pads, wherein the fourth die is attached to the second portion of the third die; and
a plurality of fourth bond wires, each attached to one of the third bond pads of the third die and to one of the fourth bond pads of the fourth die.