US Patent No. 11,071,230

HEAT DISSIPATION STRUCTURE OF HEAT GENERATING COMPONENT


Patent No. 11,071,230
Issue Date July 20, 2021
Title Heat Dissipation Structure Of Heat Generating Component
Inventorship Toshiaki Takaki, Kobe (JP)
Assignee DENSO TEN Limited, Kobe (JP)

Claim of US Patent No. 11,071,230


1. A heat dissipation structure of a heat generating component that is mounted on a wiring substrate housed in an interior of a chassis of an electronic equipment, the heat dissipation structure comprising:a heat conductive plate arranged in the interior of the chassis, the heat conductive plate including a heat receiving connecting part thermally connected to the heat generating component and a heat dissipation connecting part thermally connected to the chassis; and
an air cooling fan that generates cooling air for cooling the heat conductive plate in the interior of the chassis, wherein
the heat conductive plate further includes (i) a first heat dissipation area from which heat is dissipated by flowing the cooling air generated by the air cooling fan along a surface of the heat conductive plate and (ii) a second heat dissipation area that is bent and extends from the first heat dissipation area so as to cross an advancing direction of the cooling air that flows along the surface of the heat conductive plate at the first heat dissipation area, and from which heat is dissipated by receiving the cooling air that has flown along the surface of the heat conductive plate at the first heat dissipation area,
the heat conductive plate includes a first end located adjacent to an air outlet of the chassis, and a second end located adjacent to the air cooling fan,
the heat conductive plate forms part of a duct passage through which the cooling air flows in the advancing direction from the second end toward the first end before being exhausted through the air outlet of the chassis,
the duct passage has a width in a direction that crosses the advancing direction of the cooling air,
the second heat dissipation area is located adjacent to the first end of the heat conductive plate and is thermally connected to the chassis, and
a first portion of the cooling air that has flown along the surface of the heat conductive plate at the first heat dissipation area collides with the second heat dissipation area and a second portion of the cooling air that has flown along the surface of the heat conductive plate at the first heat dissipation area bypasses the second heat dissipation area before exiting the chassis through the air outlet of the chassis.