US Patent No. 11,071,224


Patent No. 11,071,224
Issue Date July 20, 2021
Title Functional Panel, Method For Manufacturing The Same, Module, Data Processing Device
Inventorship Shunpei Yamazaki, Tokyo (JP)
Kohei Yokoyama, Kanagawa (JP)
Yoshiharu Hirakata, Kanagawa (JP)
Assignee Semiconductor Energy Laboratory Co., Ltd., Atsugi (JP)

Claim of US Patent No. 11,071,224

1. A functional panel comprising:a first insulating layer;
a second insulating layer over and in contact with the first insulating layer;
a first base over and in contact with the second insulating layer;
a second base over the first base;
a bonding layer between the first base and the second base, wherein the bonding layer is positioned inside an end portion of the second base so that the second base has a protruding part that protrudes from the bonding layer;
a functional layer comprising a light-emitting element with a microcavity structure including a reflective film, a semi-transmissive and semi-reflective film, and a layer containing a light-emitting organic compound over the first base; and
a third insulating layer being a nitride layer and being over and in contact with an entire top surface of the second base including the protruding part and with the bonding layer,
wherein the first insulating layer and the second insulating layer overlap with the functional layer,
wherein the second insulating layer is one of an oxide layer, a fluoride layer, and a sulfide layer, and
wherein the bonding layer covers the functional layer.