US Patent No. 11,071,214


Patent No. 11,071,214
Issue Date July 20, 2021
Title Method For Manufacturing Multilayer Wiring Board
Inventorship Yoshinori Matsuura, Ageo (JP)
Yasuhiro Seto, Ageo (JP)
Toshimi Nakamura, Ageo (JP)

Claim of US Patent No. 11,071,214

1. A method of manufacturing a multilayer wiring board comprising:providing a laminated sheet comprising, in sequence, a first support, a first release layer, and a metal layer;
alternately stacking wiring layers and insulating layers on a surface of the metal layer to give a multilayer laminate, wherein an n-th wiring layer being the uppermost layer includes an n-th connection pad;
bonding a second support having an opening on a surface, remote from the laminated sheet, of the multilayer laminate with a second release layer therebetween, such that at least a part of the n-th connection pad is disposed within the opening to give a reinforced multilayer laminate, wherein the second release layer is applied to the entire area or the partial area of the surface to be bonded of the second support;
releasing the first support from the reinforced multilayer laminate at the position of the first release layer; and
putting conductors into contact with the n-th connection pads of the reinforced multilayer laminate to perform electrical inspection;
wherein a release strength of the second release layer is higher than the release strength of the first release layer.