1. A method of manufacturing a multilayer wiring board comprising:providing a laminated sheet comprising, in sequence, a first support, a first release layer, and a metal layer;
alternately stacking wiring layers and insulating layers on a surface of the metal layer to give a multilayer laminate, wherein an n-th wiring layer being the uppermost layer includes an n-th connection pad;
bonding a second support having an opening on a surface, remote from the laminated sheet, of the multilayer laminate with a second release layer therebetween, such that at least a part of the n-th connection pad is disposed within the opening to give a reinforced multilayer laminate, wherein the second release layer is applied to the entire area or the partial area of the surface to be bonded of the second support;
releasing the first support from the reinforced multilayer laminate at the position of the first release layer; and
putting conductors into contact with the n-th connection pads of the reinforced multilayer laminate to perform electrical inspection;
wherein a release strength of the second release layer is higher than the release strength of the first release layer.