US Patent No. 11,071,213

METHODS OF MANUFACTURING A HIGH IMPEDANCE SURFACE (HIS) ENHANCED BY DISCRETE PASSIVES


Patent No. 11,071,213
Issue Date July 20, 2021
Title Methods Of Manufacturing A High Impedance Surface (his) Enhanced By Discrete Passives
Inventorship Charles Muwonge, Andover, MA (US)
Kyu-Pyung Hwang, Newton, MA (US)
Terry Vogler, Charleston, SC (US)
Young Kyu Song, San Diego, CA (US)
Assignee The Boeing Company, Chicago, IL (US)

Claim of US Patent No. 11,071,213


1. A method of manufacturing a high impedance surface (HIS) apparatus, wherein the method comprises:patterning a first conducting layer on a core to form a first set of conducting pads;
patterning a second conducting layer on the core to form a second set of conducting pads;
drilling cavities that run through the first set of conducting pads, the core, and the second set of conducting pads;
forming a via in each of the cavities;
plating a surface of each of the conducting pads of the first set of conducting pads and the second set of conducting pads;
applying solder paste to each of the conducting pads of the second set of conducting pads;
placing chip capacitors on the solder paste on the second set of conducting pads;
reflowing the solder paste on the second set of conducting pads;
applying underfill between the chip capacitors;
applying solder paste to each of the conducting pads of the first set of conducting pads;
placing chip inductors on the solder paste on the first set of conducting pads;
reflowing the solder paste on the first set of conducting pads; and
applying underfill between the chip inductors.