US Patent No. 11,071,209

FITTING STRUCTURE FOR CONDUCTIVE SHEET AND ELECTRONIC DEVICE


Patent No. 11,071,209
Issue Date July 20, 2021
Title Fitting Structure For Conductive Sheet And Electronic Device
Inventorship Manabu Hayahi, Kawasaki (JP)
Assignee NEC Platforms, Ltd., Kanagawa (JP)

Claim of US Patent No. 11,071,209


1. A fitting structure for a conductive sheet, comprising:a conductive member, which is arranged in a predetermined region of a first case piece of an electronic device that includes the first case piece and a second case piece, the first case piece and the second case piece being separably coupled to each other, and is electrically connected to a ground pattern of the electronic device; and
a conductive sheet, which includes a conductive layer, and is arranged in the second case piece so as to be opposed to the predetermined region of the first case piece,
wherein, under a state in which the first case piece and the second case piece are coupled to each other, the conductive layer of the conductive sheet is brought into contact with the conductive member and is electrically connected to the ground pattern of the electronic device,
wherein the predetermined region is:a partial region on a substrate assembly arranged in the first case piece; and
a region in which an operation of the electronic device is possibly influenced by an extrinsic noise, or a region in which an unnecessary electromagnetic wave from the electronic device itself is required to be reduced or suppressed,

wherein the conductive sheet is bonded to a region that is opposed to the predetermined region in an inner side surface of the second case piece,
wherein the conductive sheet includes at least a first insulating layer, a first conductive layer as the conductive layer, and a second insulating layer that are laminated on one another,
wherein the first insulating layer includes a cutout portion for exposing a part of a surface of the conductive layer,
wherein, under a state in which the first case piece and the second case piece are coupled to each other, the conductive layer is brought into contact with the conductive member through the cutout portion of the first insulating layer of the conductive sheet and is electrically connected to the ground pattern of the electronic device.