US Patent No. 11,071,207

ELECTRONIC MODULE


Patent No. 11,071,207
Issue Date July 20, 2021
Title Electronic Module
Inventorship Risto Tuominen, Helsinki (FI)
Petteri Palm, Regensburg (DE)
Assignee IMBERATEK, LLC, Herndon, VA (US)

Claim of US Patent No. 11,071,207


1. An electronic module, comprising:a first conductive-pattern layer and a second conductive-pattern layer disposed on the first conductive-pattern layer, the second conductive-pattern layer having a first surface;
an insulating-material layer disposed on the first surface of the second conductive-pattern layer;
at least one installation cavity disposed in the insulating-material layer;
a component disposed within the at least one installation cavity, the component comprising contact zones comprising aluminum;
first contact bumps disposed on the first surface of the second conductive-pattern layer, the first contact bumps electrically connected thereto; and
second contact bumps disposed on the contact zones and electrically connected thereto,
wherein at least one of the first conductive-pattern layer and the second conductive-pattern layer comprises at least two layers of at least two different materials.