US Patent No. 11,071,206

ELECTRONIC SYSTEM AND PROCESSOR SUBSTRATE HAVING AN EMBEDDED POWER DEVICE MODULE


Patent No. 11,071,206
Issue Date July 20, 2021
Title Electronic System And Processor Substrate Having An Embedded Power Device Module
Inventorship Danny Clavette, Greene, RI (US)
Assignee Infineon Technologies Austria AG, Villach (AT)

Claim of US Patent No. 11,071,206


1. An electronic system, comprising:a board;
a power converter attached to the board and configured to convert an input voltage applied to the board to an intermediate voltage; and
a processor attached to a substrate,
wherein the substrate is attached to the board or seated in a socket attached to the board,
wherein the substrate comprises:an electrically insulating material having a first main side facing the processor and a second main side facing the board;
a plurality of electrically conductive structures embedded in the electrically insulating material and configured to provide an electrical interface between the processor and the board if the substrate is attached to the board, or between the processor and the socket if the substrate is seated in the socket; and
a power device module embedded in the electrically insulating material and configured to convert the intermediate voltage at the second main side to a voltage that is within an operating range of the processor and below a voltage limit of the substrate.