US Patent No. 11,071,203

CIRCUIT SUBSTRATE ARRANGEMENT WITH IMPROVED ELECTRICAL CONTACT


Patent No. 11,071,203
Issue Date July 20, 2021
Title Circuit Substrate Arrangement With Improved Electrical Contact
Inventorship Thomas Wiesa, Vaihingen (DE)
Andreas Meier, Pfullingen (DE)
Assignee Robert Bosch GmbH, Stuttgart (DE)

Claim of US Patent No. 11,071,203


1. A circuit carrier arrangement, comprising:an insulated metal substrate including:a base layer (2) which comprises aluminum,
a circuit layer (3) which comprises copper, and
a dielectric layer (4) which is arranged between the base layer (2) and the circuit layer (3),

an opening (5) which runs through the base layer (2), the circuit layer (3) and the dielectric layer (4) of the insulated metal substrate, and
an electrical contact (6) between the base layer (2) and the circuit layer (3), wherein the electrical contact (6) comprises a rivet (7),
wherein a force-fitting connection (8) is formed between the rivet (7) and the base layer (2), and
wherein a cohesive connection (9) is formed between the rivet (7) and the circuit layer (3).