US Patent No. 11,071,197

MULTILAYER CERAMIC ELECTRONIC PACKAGE WITH MODULATED MESH TOPOLOGY AND ALTERNATING RODS


Patent No. 11,071,197
Issue Date July 20, 2021
Title Multilayer Ceramic Electronic Package With Modulated Mesh Topology And Alternating Rods
Inventorship Jinwoo Choi, Austin, TX (US)
Daniel M. Dreps, Georgetown, TX (US)
Yanyan Zhang, Austin, TX (US)
Assignee International Business Machines Corporation, Armonk, NY (US)

Claim of US Patent No. 11,071,197


1. An electronic package including modulated mesh planes with supplemental wires and via interconnect structures for reducing signal crosstalk between adjacent signal wires within the electronic package, the electronic package comprising:a wiring plane located in a parallel planar orientation between an upper mesh plane and a lower mesh plane, the wiring plane including a set of adjacent signal wires, each signal wire of the set of adjacent signal wires extending parallel to a first axis and electrically insulated by a dielectric layer;
the upper mesh plane that includes:a first set of wires, each wire of the first set of wires extending parallel to the first axis; and
a second set of wires, each wire of the second set of wires:extending parallel to a second axis that is orthogonal to the first axis;
intersecting with and electrically interconnected to the first set of wires; and
electrically insulated from the wiring plane by a dielectric layer; and


the lower mesh plane that includes:a third set of wires, each wire of the third set of wires extending parallel to the first axis; and
a fourth set of wires, each wire of the fourth set of wires:extending parallel to the second axis;
intersecting with and electrically interconnected to the third set of wires; and
electrically insulated from the wiring plane by a dielectric layer; and


a first region of the upper and lower mesh planes, wherein adjacent wires of the second set of wires are separated by a first distance and corresponding adjacent wires of the fourth set of wires are separated by the first distance;
a second region of the upper and lower mesh planes, wherein adjacent wires of the second set of wires are separated by a second distance that is greater than the first distance and corresponding adjacent wires of the fourth set of wires are separated by the second distance;
a set of mesh areas of the upper and lower mesh planes, the mesh areas having rectangular perimeters including portions of adjacent wires of the first set of wires that intersect with portions of adjacent wires of the second set of wires;
a set of supplemental wires, each wire of the set of supplemental wires located within a first portion of the set of mesh areas and configured to electrically connect adjacent wires of the second set of wires;
a set of vias located within a second portion of the set of mesh areas; and
a set of via interconnect structures, each via interconnect structure of the set of via interconnect structures located within the second portion of the set of mesh areas and configured to electrically connect the set of vias to adjacent wires of the first set of wires and to adjacent wires of the second set of wires.