US Patent No. 11,071,196

ELECTRONIC DEVICE MODULE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE MODULE


Patent No. 11,071,196
Issue Date July 20, 2021
Title Electronic Device Module And Method Of Manufacturing Electronic Device Module
Inventorship Kyung Ho Han, Suwon-si (KR)
Assignee Samsung Electro-Mechanics Co., Ltd., Suwon-si (KR)

Claim of US Patent No. 11,071,196


1. An electronic device module, comprising:a board;
a ground electrode disposed on a first surface of the board;
a sealing portion disposed on the first surface of the board;
electronic devices mounted on the first surface of the board such that at least one of the electronic devices is embedded in the sealing portion;
a first shielding wall connected to the ground electrode and comprising a first side surface disposed along a side surface of the sealing portion;
a shielding layer formed of a conductive material; and
an external sealing portion disposed between the board and a bottom of the shielding layer,
wherein the shielding layer is disposed along a second side surface of the first shielding wall, opposite to the first side surface, is spaced apart from the board, and is disposed along a surface formed by the sealing portion and the first shielding wall.