US Patent No. 11,071,195


Patent No. 11,071,195
Issue Date July 20, 2021
Title Heatsink And Stiffener Mount With Integrated Alignment
Inventorship Ryan Tong, Hercules, CA (US)
Assignee Google LLC, Mountain View, CA (US)

Claim of US Patent No. 11,071,195

9. A method of assembling electronic components, the method comprising:inserting a post of a mount through a printed circuit board (PCB) hole in a PCB and into a bolster plate hole in a bolster plate such that the post is threadingly engaged within the bolster plate hole, a portion of a first barrel axially extends from the post passes through the bolster hole and remaining portion of the first barrel extends through the PCB hole, and a grip extending axially from the first barrel bears against the PCB, wherein the PCB includes a chip;
engaging a load cell of a heat sink with an opposite end of the mount from the post, wherein the heat sink includes a boss such that a combined height of the boss and the chip exceeds a height of the grip; and
tightening the load cell to bring the chip on the PCB into abutment with the boss of the heat sink.