US Patent No. 11,071,121

SUBSLOT BUNDLING AND ACKNOWLEDGEMENT


Patent No. 11,071,121
Issue Date July 20, 2021
Title Subslot Bundling And Acknowledgement
Inventorship Chong Li, Weehawken, NJ (US)
Junyi Li, Chester, NJ (US)
Hao Xu, Beijing (CN)
Jing Jiang, San Diego, CA (US)
Assignee QUALCOMM Incorporated, San Diego, CA (US)

Claim of US Patent No. 11,071,121


1. A method of wireless communication by a base station, the method comprising:puncturing, in at least one minislot, data or control information associated with a first type of traffic with data or control information associated with a second type of traffic;
bundling the at least one minislot within a subframe, wherein the subframe includes a portion for carrying acknowledgment (ACK)/negative acknowledgment (NACK) information associated with the data or control information associated with the second type of traffic; and
communicating with a user equipment (UE) during the at least one minislot within the subframe.