US Patent No. 11,032,959

COMPONENT MOUNTING MACHINE


Patent No. 11,032,959
Issue Date June 08, 2021
Title Component Mounting Machine
Inventorship Nobuaki Minoshima, Togo-cho (JP)
Mitsuhiko Shibata, Toyota (JP)
Assignee FUJI CORPORATION, Chiryu (JP)

Claim of US Patent No. 11,032,959

1. A component mounting machine comprising:a mounting head configured to hold multiple holding tools each of which is configured to hold a component, and select and execute an individual mode, in which lifting and lowering is performed for each holding tool, and a collective mode, in which all the holding tools are lifted and lowered collectively;
a memory section configured to store multiple groups, which are grouped in advance and in each of which the number of the components is the same as the number of holding tools, as a collective lifting and lowering scheduled group; and
a control section configured to subsequently execute holding of the components by the holding tools, dipping of the components into a coating agent, and mounting of the components on a board,
wherein the control section includes:
a collective dip control section configured to perform the dipping for the collective lifting and lowering scheduled group in the collective mode in a case where a component for which the holding by the holding tool is to be skipped is not included in the collective lifting and lowering scheduled group,
a new group allocation section configured to prohibit the holding of the component by the holding tool in the collective lifting and lowering scheduled group, in a case where the component for which the holding by the holding tool is to be skipped is included in the collective lifting and lowering scheduled group, and allocate the component for which the holding by the holding tool is not to be skipped in the collective lifting and lowering scheduled group, as the component in a new group, and
a new group dip control section configured to perform the dipping for the new group in the collective mode, in a case where the components, of which number is the same as the number of holding tools, are allocated as the components in the new group by the new group allocation section, and configured to perform the dipping for the new group in the individual mode for each holding tool that holds the allocated component in a case where the components, of which number is the same as the number of holding tools, are not allocated as the components in the new group.