US Patent No. 11,032,949

METHOD FOR DEPLOYING LIQUID COOLING SOLUTION IN AN AIR-COOLED DATA CENTER ROOM


Patent No. 11,032,949
Issue Date June 08, 2021
Title Method For Deploying Liquid Cooling Solution In An Air-cooled Data Center Room
Inventorship Tianyi Gao, Sunnyvale, CA (US)
Assignee BAIDU USA LLC, Sunnyvale, CA (US)

Claim of US Patent No. 11,032,949

1. An electronic rack of a data center, comprising:a plurality of server shelves inserted into at least some of a plurality of standard slots, each server shelf containing one or more servers and each server including one or more processors, wherein the one or more processors are mounted on one or more cold plates for liquid cooling; and
a liquid manifold shelf inserted into one of the standard slots separate from the plurality of server shelves, the liquid manifold shelf comprising a form factor that is the same as the plurality of server shelves to fit into any of the plurality of standard slots, and wherein the liquid manifold shelf includes a pair of an upstream supply port and an upstream return port and further includes one or more pairs of a downstream inlet port and a downstream outlet port,
wherein the upstream supply port is coupled to a facility liquid supply line to receive cooling liquid from an external cooling liquid source and the upstream return port to return the cooling liquid back to the external cooling liquid source, and
wherein at least some of the pairs of the downstream inlet port and downstream outlet port are coupled to the one or more cold plates of one or more of the server shelves to circulate the cooling liquid—or a second cooling liquid to provide the liquid cooling to the to provide the liquid cooling to the corresponding one or more processors.