1. A heatsink to dissipate heat generated by an electronic device, the heatsink comprising:a ribbon including:
a core including a first thermally conductive material having a first melt temperature, and
an outer layer carrying the core, the outer layer including a second thermally conductive material compositionally different from the first thermally conductive material, the second thermally conductive material having a second melt temperature less than the first melt temperature, the second thermally conductive material including a tin-based material;
wherein the ribbon includes a plurality first bends at a first angle opposed to a plurality of second bends at a second angle, respective first bends of the plurality of first bends thermally coupleable to an external surface of an electronic device and respective second bends of the plurality of second bends disposed remote from the external surface of the electronic device when respective first bends of the plurality of first bends are coupled to the external surface of the electronic device; and
wherein at least one of the first bends includes a surface feature to facilitate deformation of the respective first bend upon forcible contact with the external surface of the electronic device to provide a thermal contact area proximate the external surface of the electronic device, the surface feature to cause a portion of the ribbon at the first bend to become parallel to the external surface of the electronic device.