US Patent No. 11,032,942


Patent No. 11,032,942
Issue Date June 08, 2021
Title Structure For A Heat Transfer Interface And Method Of Manufacturing The Same
Inventorship Roger Scott Kempers, Toronto (CA)
Paul Ahern, Clonee (IE)
Alan Michael Lyons, New Providence, NJ (US)
Anthony Robinson, Laytown (IE)
Assignee Alcatel Lucent, Nozay (FR)

Claim of US Patent No. 11,032,942

1. A thermally conductive heat transfer interface structure comprising a substrate having a first surface and a second surface and a plurality of raised features formed on at least one of the first surface and the second surface of the substrate, the raised features being deformable under a compressive force, wherein at least some of the raised features each have an opening through a respective end portion thereof;wherein a thickness of a wall of a raised feature of the at least some of the raised features at said end portion is smaller than a thickness of the wall of the raised feature at an intermediate portion of the raised feature; and
wherein, one or more raised features from the plurality of the raised features each comprise a first height corresponding to a first location on the end portion thereof and a second height corresponding to a second location on the end portion thereof, wherein each one of the first height and the second height is a distance from a plane defined by the substrate to a parallel plane passing through a location on the end portion.