US Patent No. 11,032,941

MODULAR THERMAL ENERGY MANAGEMENT DESIGNS FOR DATA CENTER COMPUTING


Patent No. 11,032,941
Issue Date June 08, 2021
Title Modular Thermal Energy Management Designs For Data Center Computing
Inventorship Minh Le, North Plains, OR (US)
Thomas Boyd, Vancouver, WA (US)
Bijoyraj Sahu, Portland, OR (US)
Evan Chenelly, Portland, OR (US)
Christopher Wade Ackerman, Phoenix, AZ (US)
Carlos Alvizo Flores, Jalisco (MX)
Craig Jahne, Beaverton, OR (US)
Assignee Intel Corporation, Santa Clara, CA (US)

Claim of US Patent No. 11,032,941

1. An apparatus for thermal energy management, comprising:a first container having one or more cavities including a first cavity, wherein the first container includes a first material in a wall of the first container, one or more input inlets in the wall, and one or more output outlets in the wall,
wherein the first container is arranged to hold a first liquid coolant within the first cavity to at least partially surround one or more containers including a second container, the first liquid coolant, when held, circulates through at least an input inlet of the one or more input inlets and at least an output outlet of the one or more output outlets, and
wherein the second container includes a second material in a wall of the second container, and a second cavity configured to hold one or more heat sources, and a second liquid coolant to at least partially surround the one or more heat sources, the second container is sealed to separate the first liquid coolant from the second liquid coolant; and
wherein the apparatus further comprises a mechanical supporting system to support the one or more containers including the second container, or the one or more heat sources.