US Patent No. 11,032,939

LIQUID SUBMERSION COOLED ELECTRONIC SYSTEMS


Patent No. 11,032,939
Issue Date June 08, 2021
Title Liquid Submersion Cooled Electronic Systems
Inventorship Rick Tufty, Rochester, MN (US)
Steve Shafer, Rochester, MN (US)
Assignee LiquidCool Solutions, Inc., Rochester, MN (US)

Claim of US Patent No. 11,032,939

1. A method of cooling heat generating electronic computer components of a computing system, comprising:submerging the heat generating electronic computer components, that are mounted on an upper surface of a circuit board, of the computing system in a dielectric cooling liquid contained in an interior space defined within a liquid-tight enclosure of the computing system so that the heat generating electronic computer components are in direct contact with the dielectric cooling liquid; the liquid-tight enclosure includes a first wall, a second wall opposite the first wall, a third wall interconnecting the first wall and the second wall, a fourth wall opposite the third wall and interconnecting the first wall and the second wall, a first end wall and a second end wall; the first wall and the second wall are each larger in area than the third wall, the fourth wall, the first end wall, and the second end wall; and the upper surface of the circuit board is parallel to the first wall and to the second wall;
circulating the dielectric cooling liquid through a heat exchanger for cooling the dielectric cooling liquid without circulating the dielectric cooling liquid to a heat exchanger external to the liquid-tight enclosure, wherein the dielectric cooling liquid is circulated by a pump disposed within the interior space of the liquid-tight enclosure and submerged in the dielectric cooling liquid and the pump is not mounted on the circuit board, and the pump is positioned closer to the first end wall than it is to the second end wall; and
directing a return flow of the dielectric cooling liquid, after being cooled in the heat exchanger, into a manifold that does not overlap the upper surface and that is not affixed to the circuit board, the manifold is positioned closer to the second end wall than it is to the first end wall, and thereafter from the manifold directly onto at least one of the submerged heat generating electronic computer components or directly onto a heat sink that is fixed to the at least one submerged heat generating electronic computer component.