US Patent No. 11,032,917

CIRCUIT CARRIER BOARD AND MANUFACTURING METHOD THEREOF


Patent No. 11,032,917
Issue Date June 08, 2021
Title Circuit Carrier Board And Manufacturing Method Thereof
Inventorship Wei-Ti Lin, Hsinchu County (TW)
Chun-Hsien Chien, New Taipei (TW)
Fu-Yang Chen, Miaoli County (TW)
Assignee Unimicron Technology Corp., Taoyuan (TW)

Claim of US Patent No. 11,032,917

1. A circuit carrier board comprising:a first substrate, comprising a first circuit layer and a plurality of conductive structures electrically connected to the first circuit layer, wherein the conductive structures being adapted to be electrically connected to the plurality of electronic elements; and
a second substrate is bonded to the first substrate and contacts the first circuit layer, wherein the second substrate comprising:
a plurality of dielectric layers stacked on the first substrate in sequence; and
a plurality of second circuit layers are disposed in the dielectric layers, wherein a bottommost layer of the second circuit layers is exposed outside of the dielectric layers, and a topmost layer of the second circuit layers is electrically connected to the first circuit layer,
wherein, the conductive structures comprises a plurality of pads and a plurality of conductive vias, and the pads are electrically connected to the first circuit layer through the conductive vias,
wherein an orthographic projection of a bottom surface of each of the conductive vias contacting the first circuit layer on the second substrate is located within an orthographic projection of a top surface of each of the pads on the second substrate,
wherein a linewidth of the first circuit layer is smaller than a linewidth of the second circuit layer.