US Patent No. 11,032,916

METHOD FOR MANUFACTURING CIRCUIT BOARD


Patent No. 11,032,916
Issue Date June 08, 2021
Title Method For Manufacturing Circuit Board
Inventorship Ren-Yi Huang, New Taipei (TW)
I-Hsun Tseng, New Taipei (TW)
Yuan-Hung Chien, New Taipei (TW)
Assignee HON HAI PRECISION INDUSTRY CO., LTD., New Taipei (TW)

Claim of US Patent No. 11,032,916

1. A method for manufacturing a circuit board, comprising:providing a substrate;
printing a first conductive layer on a surface of the substrate, wherein
the first conductive layer comprises a plurality of electrode units arranged in an M by N array, N being a number of first lead, and M being a number of second leads, each of the first leads is located at one end of a corresponding column of the electrode units, each of the second leads is located at one end of a corresponding row of the electrode units,
each of the electrode units comprises a first electrode, a plurality of second electrodes distributed around the first electrode, a plurality of third leads configured for connecting the second electrodes end to end, and a plurality of forth leads configured for connecting the adjacent electrode unit;
printing a first insulating layer on a side of the first conductive layer away from the substrate, the first insulating layer comprises a plurality of insulating blocks covering the third leads;
printing a second conductive layer on a side of the first insulating layer away from the substrate, wherein the second conductive layer comprises N fifth leads, each of the fifth leads is connected to the first electrode of a corresponding column of the electrode units, and is connected to a corresponding first lead;
printing an anti-oxidation layer to cover surfaces of the first conductive layer and the second conductive layer away from the substrate; and
printing a second insulating layer to cover regions of the substrate not covered by the first electrode and the second electrode.