US Patent No. 11,032,915

SINGLE-LAYER CIRCUIT BOARD, MULTI-LAYER CIRCUIT BOARD, AND MANUFACTURING METHODS THEREFOR


Patent No. 11,032,915
Issue Date June 08, 2021
Title Single-layer Circuit Board, Multi-layer Circuit Board, And Manufacturing Methods Therefor
Inventorship Siping Bai, Zhuhai (CN)
Xianglan Wu, Zhuhai (CN)
Zhijian Wang, Zhuhai (CN)
Zhigang Yang, Zhuhai (CN)
Jinqiang Zhang, Zhuhai (CN)
Assignee RICHVIEW ELECTRONICS CO., LTD., Wuhan (CN)

Claim of US Patent No. 11,032,915

1. A method for manufacturing multi-layer circuit board, comprising:implementing a multi-layer laying-up plate and lamination in an order of surface sticking layer, single-layer circuit board, middle sticking layer, single-layer circuit board, middle sticking layer, single-layer circuit board, surface sticking layer;
drilling a hole on the multi-layer plate after lamination, the hole comprises through hole and/or blind hole;
forming a conductive seed layer to an outer surface of said surface sticking layer and a hole wall of said hole; and
forming circuit pattern on the outer surface of said surface sticking layer,
wherein forming a conductive seed layer comprises implanting a conductive material below the outer surface of said surface sticking layer below and hole wall of said hole via ion implantation, to form ion implantation layer as at least part of said conductive seed layer.