US Patent No. 11,032,911

EMBEDDED COMPONENT PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF


Patent No. 11,032,911
Issue Date June 08, 2021
Title Embedded Component Package Structure And Manufacturing Method Thereof
Inventorship Chien-Fan Chen, Kaohsiung (TW)
Chien-Hao Wang, Kaohsiung (TW)
Assignee ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung (TW)

Claim of US Patent No. 11,032,911

1. An embedded component package structure, comprising:a first dielectric layer having a first surface, the first dielectric layer having a protrusion protrudes relative to the first surface of the first dielectric layer;
a component disposed on the first dielectric layer;
a second dielectric layer disposed on the first dielectric layer and covering the component; and
a patterned circuit layer disposed on the second dielectric layer and electrically connected to the component, wherein an interface between the first dielectric layer and a bottom surface of the component is spaced apart from the first surface of the first dielectric layer by the protrusion of the first dielectric layer.