US Patent No. 11,032,910

SYSTEM-IN-PACKAGE DEVICE BALL MAP AND LAYOUT OPTIMIZATION


Patent No. 11,032,910
Issue Date June 08, 2021
Title System-in-package Device Ball Map And Layout Optimization
Inventorship Erik James Welsh, Bellaire, TX (US)
Kevin Michael Troy, College Station, TX (US)
Assignee OCTAVO SYSTEMS LLC, Sugar Land, TX (US)

Claim of US Patent No. 11,032,910

1. A system, comprising:a System-in-Package (SiP) including a SiP substrate, a plurality of SiP electronic components within the SiP, a plurality of internal electrical connections for connecting between said plurality of SiP electronic components, and an array of connectors formed on a bottom surface of said SiP substrate;
a printed circuit board (PCB), wherein said PCB comprises a top layer, a ground layer, and a power layer, wherein said top layer comprises a plurality of escape traces on a top surface of said PCB, and wherein said SiP is mounted on said top surface of said PCB; and
a plurality of electronic components mounted on said top surface of said PCB,
wherein at least one of said plurality of electronic components is electrically connected to at least one of said plurality of escape traces, and
wherein at least one of said plurality of SiP electronic components is electrically connected to at least one of said plurality of escape traces using said array of connectors.