US Patent No. 11,032,908

CIRCUIT BOARD, ASSEMBLY AND METHOD OF ASSEMBLING


Patent No. 11,032,908
Issue Date June 08, 2021
Title Circuit Board, Assembly And Method Of Assembling
Inventorship Sreenivasu Balusu, Bangalore (IN)
Assignee UOP LLC, Des Plaines, IL (US)

Claim of US Patent No. 11,032,908

1. A circuit board assembly comprising:a first circuit board comprising a first top surface with circuitry and a leading edge; said first circuit board having an edge electrode including a conductive edge trace on said leading edge, an opening in said first circuit board and a first bottom surface having a conductive first bottom surface pad on said first bottom surface;
a second circuit board having a second top surface with circuitry; said second circuit board having a conductive second top surface pad aligned with said opening, said first bottom surface pad and said edge trace in said first circuit board; and
said opening in said first circuit board containing solder establishing a bond between said first circuit board and said second top surface pad, wherein said solder is configured to reflow at a junction of said edge trace of said first circuit board and said second top surface pad of said first circuit board to metallurgically and conductively bond said edge trace with said second top surface pad.