US Patent No. 11,032,904

INTERPOSER SUBSTRATE AND CIRCUIT MODULE


Patent No. 11,032,904
Issue Date June 08, 2021
Title Interposer Substrate And Circuit Module
Inventorship Hirokazu Yazaki, Nagaokakyo (JP)
Keito Yonemori, Nagaokakyo (JP)
Takanori Tsuchiya, Nagaokakyo (JP)
Koji Kamada, Nagaokakyo (JP)
Takashi Noma, Nagaokakyo (JP)
Assignee MURATA MANUFACTURING CO., LTD., Kyoto (JP)

Claim of US Patent No. 11,032,904

1. A circuit module comprising:an interposer substrate comprising:
a body that includes a first principal surface, a second principal surface, and a third principal surface each of which is perpendicular to a height direction of the body, a distance between the first principal surface and the second principal surface being different from a distance between the first principal surface and the third principal surface in the height direction;
a first external connection conductor that is provided on the first principal surface;
a second external connection conductor that is provided on the second principal surface;
a third external connection conductor that is provided on the third principal surface; and
a wiring conductor that is provided inside the body and connects the first external connection conductor, and the second external connection conductor and the third external connection conductor, and includes a flat conductor pattern that is inside the body and has a flat plane perpendicular or substantially perpendicular to the height direction of the body, and a via conductor that is inside the body and extends in the height direction;
a first circuit board that is bonded to the first external connection conductor such that the interposer substrate is mounted to the first circuit board;
a first flat cable, including terminal conductors on a first end and a second end, the terminal conductor on the first end of the first flat cable is bonded to the second external connection conductor;
a second flat cable, including terminal conductors on a first end and a second end, the terminal conductor on the first end of the second flat cable is bonded to the third external connection conductor;
a second circuit board, bonded to the terminal conductors on the second end of the first flat cable; and
a third circuit board, bonded to the terminal conductors on the second end of the second flat cable; wherein
the first external connection conductor is connected to the second external connection conductor through the flat conductor pattern and the via conductor inside the body, and the first external connection conductor is connected to the third external connection conductor through the flat conductor pattern and the via conductor inside the body;
the circuit module is defined by a multilayer substrate structure that includes the interposer substrate and the first circuit board; and
each of the first flat cable and the second flat cable extends in a different direction.