US Patent No. 11,032,901

PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE HAVING THE SAME


Patent No. 11,032,901
Issue Date June 08, 2021
Title Printed Circuit Board And Electronic Device Having The Same
Inventorship Jung-Hwan Park, Suwon-si (KR)
Assignee Samsung Electro-Mechanics Co., Ltd., Suwon-si (KR)

Claim of US Patent No. 11,032,901

1. A printed circuit board, comprising:a first flexible insulating layer;
a first rigid insulating layer stacked on a first portion of the first flexible insulating layer; and
an electronic element embedded in the first flexible insulating layer in stacked formation with the rigid insulating layer,
wherein the first flexible insulating layer comprises a thermoplastic resin layer and a thermosetting resin layer, and
wherein the electronic element is embedded in the thermoplastic resin layer.