US Patent No. 10,993,331

HIGH-SPEED INTERCONNECTS FOR PRINTED CIRCUIT BOARDS


Patent No. 10,993,331
Issue Date April 27, 2021
Title High-speed Interconnects For Printed Circuit Boards
Inventorship Arthur E. Harkness, Jr., Milford, NH (US)
Eva M. Kenny-McDermott, Atkinson, NH (US)
Paul W. Farineau, Amherst, NH (US)
Raymond A. Lavallee, Londonderry, NH (US)
Michael Fancher, Merrimack, NH (US)
Assignee Amphenol Corporation, Wallingford, CT (US)

Claim of US Patent No. 10,993,331

1. A printed circuit board comprising:a first insulating layer and a second insulating layer;
a plurality of conductive interconnects located between the first insulating layer and adjacent to the second insulating layer of the printed circuit board, wherein the plurality of conductive interconnects extend along a planar surface of the second insulating layer; and
a first treated region on a first surface of each of the plurality of conductive interconnects that exhibits greater adhesion to the first insulating layer than a second region of the first surface when the first insulating layer is applied to the plurality of conductive interconnects, wherein each first surface is on a first side of the conductive interconnects that is opposite a second side of the conductive interconnects that contacts the planar surface of the second insulating layer, wherein the conductive interconnect supports NRZ data transmission rates between 40 Gb/s and 60 Gb/s with less than 25 dB of loss.