US Patent No. 10,993,321

WIRING SUBSTRATE


Patent No. 10,993,321
Issue Date April 27, 2021
Title Wiring Substrate
Inventorship Takahiro Hayashi, Nagoya (JP)
Assignee NGK SPARK PLUG CO., LTD., Nagoya (JP)

Claim of US Patent No. 10,993,321

1. A wiring substrate comprising:a substrate body formed by a single or a plurality of insulating layers and having a front surface and a back surface that are located at opposite sides of the substrate body;
a plurality of pads formed on the front surface, and at least one of the back surface and an inner layer surface that is located between the front and back surfaces, the plurality of pads formed on the same surface and having a staggered arrangement in plan view; and
a plurality of via conductors formed at each of the plurality of pads, the plurality of via conductors extending in a thickness direction of the substrate body with the plurality of via conductors being parallel to each other,
wherein, when focusing attention on one pad among the plurality of pads on the same surface, in plan view, an arrangement of the plurality of via conductors on the one pad is different from an arrangement of the plurality of via conductors on a plurality of immediately adjacent pads that encircle the one pad,
wherein a diameter of each of the plurality of pads formed on the at least one of the back surface and inner layer surface is larger than a diameter of each of the plurality of pads formed on the front surface,
wherein the number of the via conductors connecting to the one pad is two or more, and
wherein a group of these two or more via conductors is arranged so as to be shifted in a rotation direction in plan view by at least 30 degrees or more and 90 degrees or less with respect to other group of two or more via conductors connecting to one of the plurality of immediately adjacent pads located on the same surface.