US Patent No. 10,993,317

WAFER LEVEL OPTICAL MODULE


Patent No. 10,993,317
Issue Date April 27, 2021
Title Wafer Level Optical Module
Inventorship Yinjuan He, Cupertino, CA (US)
Karthik Shanmugam, Singapore (SG)
Peter R. Harper, Gilroy, CA (US)
Tongbi Tom Jiang, Santa Clara, CA (US)
Assignee Apple Inc., Cupertino, CA (US)

Claim of US Patent No. 10,993,317

1. An optical wafer comprising:a substrate;
one or more optical components encapsulated, at least partially, by the substrate, wherein each of the one or more optical components comprises an active side exposed on a first side of the substrate and configured to emit or sense light;
a passivation layer disposed on the first side of the substrate and over at least a portion of the active sides of the one or more optical components such that:
the active sides of the one or more optical components are exposed via a recess formed within the passivation layer; and
the passivation layer forms a sidewall of the recess configured to act as an optical barrier between the one or more optical components;
a dark photoresist layer, disposed on the passivation layer and the sidewall of the recess formed within the passivation layer, configured to reduce optical interference between the one or more optical components;
one or more printed circuit board (PCB) bars encapsulated, at least partially, by the substrate, wherein the one or more PCB bars are configured to allow electrical conductivity from the first side of the substrate to a second side of the substrate; and
at least one redistribution layer configured to electrically couple at least one of the one or more optical components to at least one of the one or more PCB bars.