1. A compensated via structure for a multi-layer PCB stackup with improved RF transmission at Ka band of satellite communication, the compensated via structure comprising:a central via;
wherein a first end of the central via is connected to an input transmission line within a first layer and a second end of the central via is connected to an output transmission line within a second layer;
a plurality of grounding posts surrounding the central via and running through the multi-layer PCB stackup; and
a compensating structure contained in a ground plane between the first and the second layers, the compensating structure comprising:
an antipad through which the central via passes wherein the antipad disconnects the central via from the compensating structure; and
at least one additional antipad through which at least one of the plurality of grounding posts passes wherein the at least one additional antipad disconnects the corresponding ones of the plurality of grounding posts from the compensating structure.