1. A method, comprising:applying a film to a leadframe having first and second surfaces, wherein the film is applied to the second surface of the leadframe;
mounting at least one component to the film;
applying a pre-mold material to cover at least a portion of the first surface of the leadframe and the at least one component;
removing the film to expose the second surface of the leadframe;
attaching a die to the second surface of the leadframe;
forming at least one electrical connection between the die and the leadframe; and
encapsulating the die, the leadframe, the at least one component and the pre-mold material with a final mold material to provide an IC package.