US Patent No. 10,991,644

INTEGRATED CIRCUIT PACKAGE HAVING A LOW PROFILE


Patent No. 10,991,644
Issue Date April 27, 2021
Title Integrated Circuit Package Having A Low Profile
Inventorship Paul A. David, Bow, NH (US)
Harry Chandra, Phoenix, AZ (US)
William P. Taylor, Amherst, NH (US)
Assignee Allegro MicroSystems, LLC, Manchester, NH (US)

Claim of US Patent No. 10,991,644

1. A method, comprising:applying a film to a leadframe having first and second surfaces, wherein the film is applied to the second surface of the leadframe;
mounting at least one component to the film;
applying a pre-mold material to cover at least a portion of the first surface of the leadframe and the at least one component;
removing the film to expose the second surface of the leadframe;
attaching a die to the second surface of the leadframe;
forming at least one electrical connection between the die and the leadframe; and
encapsulating the die, the leadframe, the at least one component and the pre-mold material with a final mold material to provide an IC package.