US Patent No. 10,991,618

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE


Patent No. 10,991,618
Issue Date April 27, 2021
Title Semiconductor Device And Method Of Manufacture
Inventorship Tai-I Yang, Hsinchu (TW)
Wei-Chen Chu, Taichung (TW)
Yung-Chih Wang, Taoyuan (TW)
Chia-Tien Wu, Taichung (TW)
Hsin-Ping Chen, Hsinchu County (TW)
Shau-Lin Shue, Hsin-Chu (TW)
Assignee TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED, Hsin-Chu (TW)

Claim of US Patent No. 10,991,618

1. A semiconductor device, comprising:a conductive line;
a conductive via over and contacting the conductive line;
a first dielectric material contacting a first sidewall surface of the conductive via; and
a second dielectric material contacting a second sidewall surface of the conductive via, wherein the first dielectric material comprises a first material composition, and the second dielectric material comprises a second material composition different than the first material composition.