1. An electronic modulating device, comprising:a first substrate;
a second substrate disposed opposing to the first substrate;
a modulating material disposed between the first substrate and the second substrate;
a buffer layer disposed on the first substrate, and the buffer layer comprising a first opening defining a first top edge and a first bottom edge of the buffer layer;
a first electrode disposed on the buffer layer, and the first electrode comprising a second opening defining a second top edge and a second bottom edge of the first electrode; and
an organic insulating layer disposed on the first electrode and within the first opening and the second opening;
wherein a thickness of the organic insulating layer at the second bottom edge is greater than a thickness of the organic insulating layer at the first top edge, wherein a distance between the second bottom edge and the first top edge is in a range from 1 ?m to 50 ?m.