US Patent No. 10,988,373


Patent No. 10,988,373
Issue Date April 27, 2021
Title Mems Component Having Low-resistance Wiring And Method For Manufacturing It
Inventorship Christoph Schelling, Stuttgart (DE)
Assignee Robert Bosch GmbH, Stuttgart (DE)

Claim of US Patent No. 10,988,373

1. A MEMS component, comprising: a first substrate having at least one first insulating layer and a first metallic coating on a first side; and a second substrate having at least one second insulating layer and a second metallic coating on a second side, the second substrate including a micromechanical functional element, which is connected electroconductively to the second metallic coating; a hybrid bond connection between the first substrate and the second substrate, wherein the first side and the second side are positioned on each other, the first insulating layer and the second insulating layer being interconnected, and the first metallic coating and the second metallic coating being interconnected mechanically and electrically, wherein vertical electrodes, which are situated oppositely to the micromechanical functional element at an electrode distance determined solely by a layer thickness of the second insulating layer locally removed between the vertical electrodes and the micromechanical functional element, are formed in the second metallic coating, and the electrodes are externally contactable with the aid of the first metallic coating.