1. An electronic component removal device, comprising:a cutting wire routed through a cutting region configured to receive an electronic component coupled to a substrate;
a leading actuator coupled to a leading end of the cutting wire to cause movement of the cutting wire in a cutting direction at a cutting speed through the cutting region;
a trailing resistance device coupled to a trailing end of the cutting wire to resist movement of the cutting wire in the cutting direction through the cutting region, the trailing resistance device being actuatable to variably control a resistance force applied to the cutting wire; and
a leading tension sensor operable to sense a leading tension in the cutting wire between the cutting region and the leading actuator,
wherein the trailing resistance device is actuated based on the leading tension in the cutting wire sensed by the leading tension sensor.