US Patent No. 10,973,155

HEAT DISSIPATION PLATE ASSEMBLY, DISPLAY MODULE AND ITS ASSEMBLING METHOD


Patent No. 10,973,155
Issue Date April 06, 2021
Title Heat Dissipation Plate Assembly, Display Module And Its Assembling Method
Inventorship Yang Gao, Beijing (CN)
Shuquan Yang, Beijing (CN)
Qiang He, Beijing (CN)
Chao Yang, Beijing (CN)
Yang Yang, Beijing (CN)
Mengyuan Pang, Beijing (CN)
Assignee Chengdu Boe Optoelectronics Technology Co., Ltd., Sichuan (CN) Boe Technol...

Claim of US Patent No. 10,973,155

1. A heat dissipation plate assembly for heat dissipation of a display substrate, the display substrate comprising a first region, a second region, and a bendable region between the first region and the second region,wherein the heat dissipation plate assembly comprises:
a first release film;
a heat dissipation plate, comprising a first portion and a second portion which are separated by a space and located on the first release film;
a protective film, located on a side of the heat dissipation plate distal to the first release film, having a substantially same shape as the heat dissipation plate, and comprising a third portion located on the first portion and a fourth portion located on the second portion, the third portion being able to be bonded to the first region of the display substrate, and the fourth portion being able to be bonded to the second region of the display substrate; and
a second release film, located on a side of the protective film distal to the heat dissipation plate and having a substantially same shape as the first release film,
wherein the heat dissipation plate is integrated with the protective film, and a portion of the protective film corresponding to the bendable region of the display substrate is removed while the heat dissipation plate is subjected to a cutting processing.