US Patent No. 10,973,154

RECONFIGURABLE THERMAL CONTROL OF HIGH-POWERED INTEGRATED CIRCUITRY


Patent No. 10,973,154
Issue Date April 06, 2021
Title Reconfigurable Thermal Control Of High-powered Integrated Circuitry
Inventorship Tong W. Chao, San Jose, CA (US)
Prabhakar Subrahmanyam, San Jose, CA (US)
Assignee Intel Corporation, Santa Clara, CA (US)

Claim of US Patent No. 10,973,154

1. An assembly, comprising:a pedestal member having a first surface and a second surface opposite to the first surface, the second surface to receive an amount of heat from a semiconductor package and the pedestal member comprising a first thermally conductive material; and
one or more attachment members removably mounted to respective one or more side surfaces of the pedestal member, each of the one or more attachment members comprising a respective second thermally conductive material and to receive a respective second amount of heat from the pedestal member;
a control unit configured to identify a number of the one or more attachment members to be removably mounted to the respective one or more side surfaces of the pedestal member, wherein the number of the one or more attachment members is based at least on a configurable target for power dissipation of the semiconductor package; wherein a first attachment member of the one or more attachment members comprises a base member removably mounted to a side surface of the one or more side surfaces, and wherein the base member comprises a first flange and a second flange substantially orthogonal to the first surface, the first flange defines first openings to receive respective first fastening members and the second flange defines second openings to received respective second fastening members.