1. A power module comprising:a circuit board comprising a first side and a second side opposite to each other, wherein the circuit board comprises at least one first plane and at least one second plane, which are disposed on a surface of the first side, and a first height difference is formed between the at least one first plane and the at least one second plane; and
at least one first heat-generating component and at least one second heat-generating component disposed on the at least one first plane and the at least one second plane, respectively, wherein the at least one first heat-generating component comprises at least one first contact surface, the at least one second heat-generating component comprises at least one second contact surface, and the at least one first contact surface and the at least one second contact surface are coplanar with a first collaborative plane of the power module.