US Patent No. 10,973,150

HEAT DISSIPATION ASSEMBLY AND MAINBOARD MODULE


Patent No. 10,973,150
Issue Date April 06, 2021
Title Heat Dissipation Assembly And Mainboard Module
Inventorship Shun-Chih Huang, New Taipei (TW)
Tai-Chuan Mao, New Taipei (TW)
Yi-Jhen Lin, New Taipei (TW)
Assignee GIGA-BYTE TECHNOLOGY CO., LTD., New Taipei (TW)

Claim of US Patent No. 10,973,150

1. A heat dissipation assembly, comprising:a case comprising a cavity, a first water hole, and a second water hole, wherein the cavity comprises a first region and a second region communicated with each other, and the first water hole and the second water hole are communicated with the first region of the cavity; and
a partition structure comprising a separation wall and a separation layer connected to each other, wherein the separation wall is vertically disposed in the first region of the cavity to separate a first flow path and a second flow path disposed in left and right portions in the first region, and the separation layer is horizontally disposed in the second region of the cavity to separate a third flow path and a fourth flow path disposed in upper and lower portions in the second region, wherein the first flow path is communicated with the third flow path, the third flow path is communicated with the fourth flow path, and the fourth flow path is communicated with the second flow path,
wherein a fluid sequentially flows from the first flow path which is one of the left and right portions of the first region separated by the separation wall into the third flow path which is one of the upper and lower portions of the second region separated by the separation layer, then flows into the fourth flow path which is the other one of the upper and lower portions of the second region separated by the separation layer, and then flows into the second flow path which is the other one of the left and right portions of the first region separated by the separation wall, or flows from the second flow path which is one of the left and right portions of the first region separated by the separation wall into the fourth flow path which is one of the upper and lower portions of the second region separated by the separation layer, then flows into third flow path which is the other one of the upper and lower portions of the second region separated by the separation layer, and then flows into the first flow path which is the other one of the left and right portions of the first region separated by the separation wall.