US Patent No. 10,973,149

STREAMLINED AIR BAFFLE FOR ELECTRONIC DEVICE


Patent No. 10,973,149
Issue Date April 06, 2021
Title Streamlined Air Baffle For Electronic Device
Inventorship Chao-Jung Chen, Taoyuan (TW)
Yu-Nien Huang, Taoyuan (TW)
Herman Tan, Taoyuan (TW)
Chih-Wei Lin, Taoyuan (TW)
Assignee QUANTA COMPUTER INC., Taoyuan (TW)

Claim of US Patent No. 10,973,149

1. An air baffle for directing air flow to a heat sink, the air baffle comprising:a top cover plate defined by a convex portion and a concave portion;
a pair of side walls, the side walls connected to the top cover plate, a portion of the concave portion of the top cover plate and one end of the side walls defining an inlet; opposite ends of the side walls and a portion of the convex portion of the top cover plate defining an outlet; and
one or more interior vanes coupled to the top cover plate and spaced apart from the pair of side walls, the one or more interior vanes defining a plurality of interior channels extending from the inlet to the outlet, wherein each channel of the plurality of interior channels comprises a plurality of air scoops positioned between the convex portion and the concave portion, wherein the plurality of air scoops divert air flow from the outlet to reduce air turbulence within the channel of the plurality of interior channels.